LaAlO3, (110) 5x5x0.5 mm substrate, one side Epi polished CeO2 Epi-thin film on YSZ Surface Roughness: Epi polished (Ra)

Surface  Roughness: Epi polished (Ra) <  5A

Size: 4'' diameter x 0

Hardness:                                   5

5µL to 5mL upon request

Various types of samples can be placed in a plurality of vacuum storage tanks and placed directly in the glove box (pic 3 and pic 4)

LaAlO3, (110) 5x5x0.5 mm substrate, one side Epi polished CeO2 Epi-thin film on YSZ Surface Roughness: Epi polished (Ra)Substrate Specifcations: Wafer Size: 5 x 5 x 0. 5 mm thickness + 0. 05 mm Wafer Orientation: (110) + 0. 5 Deg Polishing: One side CMP polished with free sub surface damaged Surface finish (RMS or Ra) : < 15A Package: Under 1000 class clean room, and in 100 grade plastic bag in a wafer container.