Si Wafer (110), 2" dia x 0.5 mm t, 2SP, P type/ B doped, R:0.1-1.0ohm-cm Glovebox dicing and slicing all kinds
$67.58
Description
dicing and slicing all kinds of materials especially for brittle crystals
Lattice matched In/Ga alloy layer of N-type InGaAs(undoped)
Crystal Structure: cubic a = 6
: <100> +/-2 o
Xinbing Zhao from Zhejiang University
Si Wafer (110), 2" dia x 0.5 mm t, 2SP, P type/ B doped, R:0.1-1.0ohm-cm Glovebox dicing and slicing all kindsSingle crystal Silicon Conductive type: P type Boron doped Resistivity: 0. 1 1. 0 ohm cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.) Size: 50. 8 diameter + 0. 5 mm x 0. 5 + 0. 025 mm Orientation: (110) + 1o Polish: Two sides polished Surface roughness: < 5A Optional: you may need tool below to handle the wafer ( click picture to order ) Other Crystal wafer A Z Plasma
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