Flexible Electronic Packaging and Encapsulation Technology (Hong Meng) THE WALL STREET JOURNAL

THE WALL STREET JOURNAL

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Flexible Electronic Packaging and Encapsulation Technology (Hong Meng) THE WALL STREET JOURNALSystematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology. Autorenportrait Prof. Hong Meng received his Ph. D. from University of California Los Angeles (UCLA) in 2002. He has been working in the field of organic electronics for more than 30 years. His career experiences including working at the Institute of Materials Science and