P02800 - SEMI P28 - 集積回路製造用オーバーレイ計測テストパターン StdPbc-0516 flip chip bumping

flip chip bumping

It applies to PV Si wafers that are marked with one of the marks as described in SEMI PV29 and SEMI PV32

SEMI E39 —Object Services Standard: Concept

form a complete Interoperability Specification for the ISPM

approval requirements

P02800 - SEMI P28 - 集積回路製造用オーバーレイ計測テストパターン StdPbc-0516 flip chip bumpingNOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI global Micropatterning Committee2007425global Audits and Reviews Subcommittee20076www. semi. org1996 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met.