P01000 - SEMI P10 - フォトマスクオーダーのデータ構造の仕様 Revision:SEMI P10-0709 - Superseded this Test Method does not

this Test Method does not recommend etching

This test method should be used to protect semiconductor fabrication processes using the UHP gases

This Test Method covers square and pseudo-square PV Si wafers

and what the resulting activity should be

This Specification applies to all semiconductor manufacturing equipment that supports the data acquisition interface defined in the SEMI Specification for Data Collection Management

P01000 - SEMI P10 - フォトマスクオーダーのデータ構造の仕様 Revision:SEMI P10-0709 - Superseded this Test Method does notglobal Micropatterning Committee2008513global Audits and Reviews Subcommittee20066www. semi. org20087CD ROM199020077 Referenced SEMI Standards SEMI P1 Specification for Hard Surface Photomask Substrates SEMI P2 Specification for Chrome Thin Films for Hard Surface Photomasks SEMI P4 Specification for Round Quartz Photomask Substrates SEMI P5 Specification for Pellicles SEMI P6 Specification for Registration Marks for Photomasks SEMI P21 Guidelines for