G03200 - SEMI G32 - Guideline for Unencapsulated Thermal Test Chip StdPbc-0220 SEMI PV62-0215 (Reapproved 0121)

SEMI PV62-0215 (Reapproved 0121)

SEMI T7-0997 (first published)

本文件包含下列章節：

as well as the MOTIONNET Public Specification

and 16 nm technology generation as anticipated by the International Technology Roadmap for Semiconductors (ITRS) and in the forecasts of the major manufacturers of semiconductor devices

G03200 - SEMI G32 - Guideline for Unencapsulated Thermal Test Chip StdPbc-0220 SEMI PV62-0215 (Reapproved 0121)This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www. semiviews. org and www. semi. org in August 2011; originally published in 1994. NOTICE: This Document was reapproved with minor editorial changes. This Guideline details recommendations for a standardized thermal test chip design for