HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices StdTpc-Cluster Tools and touch panel

and touch panel

SEMI MF728-1106 (technical revision)

SEMI E111 — Specification for a 150mm Reticle SMIF Pod (RSP150) Used to Transport and Store a 6 Inch Reticle

Bonding wire

originally published in 1994

HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices StdTpc-Cluster Tools and touch panelThis Standard was technically approved by the HB LED Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 17, 2018. Available at www. semiviews. org and www. semi. org in December 2018; originally published June 2013. This Specification provides the dimensional requirements for plastic and metal wafer cassettes used for the processing and handling of 150 mm diameter HB LED