G01800 - SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes StdPbc-0418 SEMI F78-0624 (technical revision)

SEMI F78-0624 (technical revision)

See Related Information 1 appended to this Standard

others on back-surface illumination

ceramic and membrane construction

This Standard stipulates materials relating to transport of 300 mm wafers using shipping boxes (FOSB) regulated by SEMI M31

G01800 - SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes StdPbc-0418 SEMI F78-0624 (technical revision)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is for the leadframe material that will be shipped to an etch house. It is a leadframe specification, but deals with material aspects only. This Specification covers the special requirements for metal