M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - Historical This Specification provides common characteristics

This Specification provides common characteristics of Ag paste based on currently widely used for photovoltaic applications

ship/scrap)

and textual process information

이 개정판의 발행은 2011년 12월 24일Audits and Reviews Subcommittee에 의해 승인되었다

It provides an indication of the flush volume required to bring particle levels to specification

M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - Historical This Specification provides common characteristicsThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 27, 2010. Initially available at www. semi. org in October 2010. Originally published November 2001. NOTICE: This document was balloted and approved for withdrawal in 2010. The purpose of this document is to provide a guide for evaluation of chemical mechanical polishing (CMP)