G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded 1 The purpose of this

1  The purpose of this Standard is to standardize requirements for ammonium hydroxide used in the semiconductor industry and testing procedures to support those standards

in order to control particulate contamination from those gases

It assumes the existence of terminology described in other SEMI Flat Panel Display Documents

SEMI E99-1104E (editorial revision)

11-0301 (first published)

G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded 1 The purpose of thisThis Test Method defines a procedure for the evaluation of die strength by the mean of 3 point bending method. This Test Method applies only for 3 point bending method, and other methods will be defined by the separate documents. This Test Method is used to measure die strength for dies from processed wafers. Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and