C00357 - SEMI C3.57 - シリンダ中の電子的グレード二酸化炭素，CO2の仕様 Revision:SEMI C3.57-0312 - Superseded 2 This Guide describes wafers

2  This Guide describes wafers and wafer stacks with nominal diameter of 300 mm and nominal thickness of 775 µm

The contacting method has more accuracy than light interference method

The purpose of this Test Method is to determine procedures for die shear strength testing

a plate sensor (PS) or ring sensor (RS) may be used

the user estimates either the probability density function (PDF) or cumulative distribution function (CDF) of the process characteristic or characteristics of interest

C00357 - SEMI C3.57 - シリンダ中の電子的グレード二酸化炭素，CO2の仕様 Revision:SEMI C3.57-0312 - Superseded 2 This Guide describes wafersglobal Gases Technical Committee20111224global Audits and Reviews Subcommittee20123www. semiviews. org www. semi. org20006 (CO2) (CO2) Referenced SEMI Standards None.