G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title focusing on real world rather

focusing on real world rather than algorithm development

Topic & Readings

SEMI E126-0305 (technical revision)

SEMI MS2 — Test Method for Step Height Measurements of Thin Films

limit of detection (LOD) and tw0

G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title focusing on real world ratherThis document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.