MC889 High Speed Pick & Place Placement Heads:8 Heads precise control of wave height

precise control of wave height and solder volume through adjustable speed and acceleration

An onboard cleanliness tester continuously monitors contamination levels and automatically adjusts the process to ensure every board meets programmed standards

Consistent extraction: improves repeatability

Po = Distance from one to the next sprocket hole which is 4mm (EIA-481 Standard)

reduces errors

MC889 High Speed Pick & Place Placement Heads:8 Heads precise control of wave heightHigh Throughput Placement with Multi Head Precision The MC889 is designed for high volume production, delivering placement speeds up to 20,000 CPH with configurations of 6, 8, or 10 placement heads. It maintains high accuracy of 30 m (3 Sigma) while handling components from 01005 up to 100 150 mm. Up to 20,000 CPH: high speed placement for large scale production 6, 8, or 10 heads: increased head count boosts throughput 30 m accuracy (3 Sigma): ensures