G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced This Specification covers the substrate

This Specification covers the substrate requirements for monocrystalline high-purity indium phosphide wafers used in semiconductor and electronic device manufacturing

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The flexible display shows green pattern of full screen

150 and 200 mm wafer shipping boxes

a fitting body temperature range of 23°C to 125°C (73°F to 257°F) should be maintained

G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced This Specification covers the substrateThis specification defines the acceptance criteria for ceramic pin grid array packages produced utilizing pressed ceramic, mechanically inserted pins and solder for electrical interconnection of pins. Referenced SEMI Standards None.