G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Chemical & Gas General Specifications originally published February 2000

originally published February 2000

which provides a unified standard for the manufacture

and dimensions of the components

本テスト方法は，Gate Oxide Integrity （GOI）によるウェーハ品質評価法に関するものである。GOIはシリコン基板中に存在するCOPを検出するために用いられてきたが，よく知られているように表面に存在する欠陥検出の画で非常に高感度である。そのためGOI測定は，ウェーハメーカやデバイスメーカにおいて幅広く用いられている手法である。

MALY specification applies to the input data format for mask tools

G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Chemical & Gas General Specifications originally published February 2000Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of