E03500 - SEMI E35 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment Revision:SEMI E35-0200 - Superseded Various organic compounds on wafer

Various organic compounds on wafer surfaces can cause a pseudo increase of the thickness of the native oxide film

This overview Guide provides process development

NOTICE: This Document was balloted and approved for withdrawal in 2012

1 This Standard defines the index of measurement for Mura in Flat Panel Display (FPD) image quality inspection

SEMI M57-1011 (technical revision)

E03500 - SEMI E35 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment Revision:SEMI E35-0200 - Superseded Various organic compounds on waferThe purpose of this Guide is to provide standard cost of ownership (COO) metrics for evaluating unit production cost effectiveness of manufacturing equipment in the semiconductor and related industries. This Guide establishes a procedure to facilitate an understanding of equipment related costs, including costs related to environmental, health, and safety (EHS) factors, by providing definitions, classifications, algorithms, methods, and example values