C10200 - SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing StdPbc-0094 This Document is not intended

This Document is not intended to describe a measurement procedure

Since a 3D stacking process may include wafers from multiple fabrication facilities

This Test Method is intended to demonstrate the ability of a POU gas filter to equal or exceed a specific particle filtration efficiency class when challenged with a monodispersed aerosol in the size range described in § REF _Ref44403816 \h \r \t \* MERGEFORMAT 7

The format of such information is not detailed in this Specification

프로세싱이 완료된 후 재료의 처리(disposing)와 같은 서비스를 제공하지 않는다

C10200 - SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing StdPbc-0094 This Document is not intendedThis Standard will provide a guide for consistent measurements and reporting measurement conditions of density of chemical mechanical planarization (CMP) pads. This Standard recommends using additional metrologies for measurements of CMP pad density, such as liquid or gas pycnometer metrologies. This Standard does not recommend stopping reporting density parameters using industry traditional metrology based on determining the weight and geometry of