P02700 - SEMI P27 - Parameter Checklist for Resist Thickness Measurement on a Substrate StdPbc-0220 an automated approach to fabrication

an automated approach to fabrication of suitable test structures using standard tools available in modern wafer fabs

SEMI PV64-0714 (Reapproved 0121)

주의: "참고:" 는 본 문서의 공식적인 내용이 아니며

SEMI MF95-1107 (technical revision)

SEMI F75-0617 (complete rewrite)

P02700 - SEMI P27 - Parameter Checklist for Resist Thickness Measurement on a Substrate StdPbc-0220 an automated approach to fabricationThis checklist was technically approved by the Global Micropatterning Committee and is the direct responsibility of the Japanese Micropatterning Committee. Current edition approved by the Japanese Regional Standards Committee on April 28, 2003. Initially available at www. semi. org June 2003; to be published July 2003. Originally published in 1996. NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain