G04500 - SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds StdTpc-FPD Masks SEMI E82-1106 (Reapproved 0523)

SEMI E82-1106 (Reapproved 0523)

It is intended to apply to polished wafers as specified in SEMI M1

the epitaxial layer must be of the same conductivity type as the substrate and should be at least twice as thick as the maximum depletion width in deep depletion to avoid errors caused by the proximity of the epitaxial interface (refer to ¶ 12

A gas conforming to the specifications will commonly contain more of the major component than the minimum permissible limit or contain less of an impurity (or several impurities) than the SEMI C3 maximum permissible limit

SI units are the reference units for this Guide

G04500 - SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds StdTpc-FPD Masks SEMI E82-1106 (Reapproved 0523)This specification defines a procedure for measuring the flashing characteristics of semiconductor grade transfer molding compounds. The flashing tendency for semiconductor grade molding compounds depends on the interaction of several variables, including mold conditions, process parameters, molding compound viscosity, and curing characteristics. This test is not a valid method for predicting the flashing performance in all mold types. It is a method