Sanken HWM900-004 Power Supply Panasonic Flip Chip Bonder System Used Working NSOM Topaz Interface Module is

NSOM Topaz Interface Module is used working surplus

Length: 40"

Model No: ADDDISP

For use with a AMAT Applied Materials 300mm Endura System This Tosoh 805-435-SG Chamber Lower Shield is new surplus

CABLE ASSY 5000 ANALOG VME TO WIRING DIST

Sanken HWM900-004 Power Supply Panasonic Flip Chip Bonder System Used Working NSOM Topaz Interface Module isSanken HWM900 004 Power Supply Panasonic Flip Chip Bonder System Used Working Inventory # A 13825 Part No: HWM900 004 Input: 120 230VAC, 13A, 50 60Hz Output: 5V 40A, 12V 8. 3A, 12V 8. 3A, 24V 4. 1A, 36V 5. 6A Removed from a Panasonic FB30T M Create Flip Chip Bonder System Made in Japan This Sanken HWM900 004 Power Supply is used working surplus. Removed from a Panasonic FB30T M Create Flip Chip Bonder System. The physical condition is good, but there