D00900 - SEMI D9 - Terminology for FPD Substrates StdDcs-Replaced where at least one is

where at least one is a device wafer

1-1101 (technical revision)

SEMI E33 — Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC)

The intent of the shock test is to provide further assessment of equipment malfunction that may result from shocks experienced during unpacking

customary units shall be used for wafers of 2- and 3-inch nominal diameter and System International (SI)

D00900 - SEMI D9 - Terminology for FPD Substrates StdDcs-Replaced where at least one isNOTICE: This Document was reapproved with minor editorial changes. This Document provides terms and definitions of materials and defects within and on the surface of flat panel display (FPD) substrates and of dimensional, thermal, chemical, optical, and mechanical properties of FPD substrates. These terms and definitions are applicable to both front and back substrates used in FPD fabrication. Referenced SEMI Standards (purchase separately) SEMI D3