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PV02200 - SEMI PV22 - 太陽光電池用シリコンウェーハの仕様 Revision:SEMI PV22-1011 - Superseded and the purity
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Description
and the purity
Height variations over specified distances (determined by CMP issues and/or lithography systems) need to be properly controlled to assure that wafers are acceptable for selected process steps
Pitting corrosion is believed to be a major corrosion failure mode in semiconductor gas delivery systems
this document has a limited scope as specified in § 2
SEMI E87-0999 (first published)
PV02200 - SEMI PV22 - 太陽光電池用シリコンウェーハの仕様 Revision:SEMI PV22-1011 - Superseded and the purityglobal Photovoltaic Committee2011912global Audits and Reviews Subcommittee201110www. semiviews. org www. semi. org (PV) Referenced SEMI Standards SEMI M35 Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection SEMI M44 Guide to Conversion Factors for Interstitial Oxygen in Silicon SEMI M53 Practice for Calibrating Scanning Surface Inspection Systems Using Depositions of Monodisperse Polystyrene Latex
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